Epoxy Formulation for Electronic Applications

This week we will again be discussing various advancements in the field of electronics. First, we will discuss about Master Bond's Epoxy Formulation for Electronic Application.

Master Bond Inc. was founded in 1976. Our focus has been on developing the best in epoxies, silicones, polyurethanes, polysulfides, UV cures and other specialty adhesive systems. We are true specialists in our field and are recognized by many as the preeminent adhesive formulation company in the world.

Through research and development, we have been able to create innovative, new compounds with truly unique properties. This effort has been led by our Technical Director, Dr. Walter Brenner. Dr. Brenner received his Ph.D. in Polymer Chemistry from Brooklyn Polytechnical Institute. He is a renowned Professor of Chemical Engineering and has served as a consultant for various U.S. Government agencies. He holds numerous patents and is credited with being the first person to develop electron beam radiation curing.

Master Bond has added another polymer system which has a lower viscosity, two component, flexibilized epoxy resin system for high performance bonding, coating, sealing and encapsulating. EP21FL is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio by weight. 

It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four to one mix ratio by weight. This compound is 100% reactive and does not contain any solvents or volatiles. It bonds well to a variety of substrates, including metals, glass, ceramics and many plastics. Since it is a toughened system, it is ideal for bonding dissimilar substrates with differing coefficients of expansion. EP21FL is effective for bonding surfaces subjected to rigorous thermal cycling as well as thermal and mechanical shocks. EP21FL is a wonderful potting compound, particularly for larger encapsulations. Its excellent electrical insulation properties are especially significant. EP21FL features an exceptionally long working life, along with a low exotherm while curing. It is resistant to chemicals including water, oils, salts, etc., over the wide temperature range of -100°F to +250°F. Part A is transparent and the color of Part B amber-clear. Master Bond EP21FL is widely used in electronic, electrical, optical and aerospace application, among others.

Product Advantages

• Convenient mixing: four to one ratio by weight.
• Toughened epoxy ideal for bonding dissimilar substrates subjected to rigorous thermal cycling.
• Lower viscosity; easy applied for bonding, coating and encapsulation.
• Versatile cure schedules: ambient temperature cures or faster, elevated temperature cures.
• Low exotherm, appropriate for larger castings.
• Superior durability, thermal shock and chemical resistance.
• Outstanding ability to withstand thermal cycling.
• Excellent electrical insulation properties.
• Exceptionally long working life.

To learn more about Master Bond's EP21FL, click on the link below:
http://www.eeweb.com/company-news/master_bond/epoxy-formulation-for-electronic-applications