Are you having some kind of a project related to circuitry? Have you experienced some thermal mismatch, corrosion, or moisture on your ICs before? Now, to reduce the risks of damages and increase the protection of the components, we recommend you to use any of Master Bond's Glob Top Chip-on-Board (COB) Encapsulation solutions.
Master Bond offers 3 types of coating which are One Component Epoxies,
Two Component Epoxies, and UV Curing Systems. Either of the three types,
you are assured of an economical, space-saving solution offering
environmental protection, mechanical support, and thermal dissipation
for large chip on board devices.
No comments:
Post a Comment